Asia Symposium on Quality Electronic Design (ASQED)

ASQED 2015 Call for Papers


ASQED 2015 Call for Paper is now closed. Please submit your papers to ISQED.

For any question regarding the paper and tutorial submissionplease contact the publication committee by sending email to asqed2015 @ Please note the following important dates:

Extended (FINAL) Paper Submission Deadline Full Length paper April 20, 2015
Acceptance Notification May 23, 2015
Camera-Ready Paper Due July 3, 2015
Conference Aug. 3-5, 2015


ASQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities.ASQED2015 starts with a full day of invited presentation and panels covering Innovations in Internet of Things (IOT), followed by a second day of peer-reviewed technical presentations in four parallel tracks, hosting many technical presentations, tutorials and other informal meetings. ASQED 2015 is held with technical sponsorship of IEEE Circuits and Systems Society (CASS), IEEE Electron Devices Society (EDS), and IEEE Reliability Society. Past ASQED papers have been published in IEEE digital library Xplore and indexed by Scopus. All past conference proceedings have been published by IEEE and posted in the IEEE digital library and indexed by Scopus.

Papers are requested in the following areas

As a premier Asia Symposium, ASQED accepts and promotes papers in following areas:


IC and System-level Design & Test System-level Design, Methodologies & Tools

    • Analog, Digital, Mixed-Signal and RFIC Design
    • FPGA Architecture, Design, and CAD
    • Robust & Power-conscious Circuits & Systems
    • Design of Reliable & Fault Tolerant Circuits and Systems
    • Design of Embedded Systems

IP Design, Quality, Interoperability and Reuse

    • Design Verification and Design for Testability
    • Physical Design, Methodologies & Tools
    • EDA Methodologies, Tools, Flows

Semiconductor Process and Devices Emerging/Innovative

    • Process & Device Technologies
    • Yield and Reliability Analysis, Prediction, and Management

Advanced IC Packaging, 3D ICs IC Package - Design Interactions & Co-Design

    • Advanced 3D ICs & 3D Packaging
    • High density PCB/PWB
    • Signal and Power Integrity

IoT, and Smart Sensors Technology, Design and Applications

Antennas Technology, Design and Applications



Submission of Papers

Paper submission must be done on-line through the conference web site at TBD. The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 6 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email asqed2015 @

Resources for Authors