ASQED 2015 Call for Papers
ASQED 2015 Call for Paper is now closed. Please submit your papers to ISQED.
- PDF Version of Call for Papers
- Submit Your Paper (only for authors of accepted papers to submit the final version of paper)
For any question regarding the paper and tutorial submissionplease contact the publication committee by sending email to asqed2015 @ asqed.com. Please note the following important dates:
| IMPORTANT DATES | |
| Extended (FINAL) Paper Submission Deadline Full Length paper | April 20, 2015 |
| Acceptance Notification | May 23, 2015 |
| Camera-Ready Paper Due | July 3, 2015 |
| Conference | Aug. 3-5, 2015 |
ASQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities.ASQED2015 starts with a full day of invited presentation and panels covering Innovations in Internet of Things (IOT), followed by a second day of peer-reviewed technical presentations in four parallel tracks, hosting many technical presentations, tutorials and other informal meetings. ASQED 2015 is held with technical sponsorship of IEEE Circuits and Systems Society (CASS), IEEE Electron Devices Society (EDS), and IEEE Reliability Society. Past ASQED papers have been published in IEEE digital library Xplore and indexed by Scopus. All past conference proceedings have been published by IEEE and posted in the IEEE digital library and indexed by Scopus.
Papers are requested in the following areas
As a premier Asia Symposium, ASQED accepts and promotes papers in following areas:
IC and System-level Design & Test System-level Design, Methodologies & Tools
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• Analog, Digital, Mixed-Signal and RFIC Design
• FPGA Architecture, Design, and CAD
• Robust & Power-conscious Circuits & Systems
• Design of Reliable & Fault Tolerant Circuits and Systems
• Design of Embedded Systems
IP Design, Quality, Interoperability and Reuse
- • Design Verification and Design for Testability
• Physical Design, Methodologies & Tools
• EDA Methodologies, Tools, Flows
Semiconductor Process and Devices Emerging/Innovative
- • Process & Device Technologies
• Yield and Reliability Analysis, Prediction, and Management
Advanced IC Packaging, 3D ICs IC Package - Design Interactions & Co-Design
- • Advanced 3D ICs & 3D Packaging
• High density PCB/PWB
• Signal and Power Integrity
IoT, and Smart Sensors Technology, Design and Applications
Antennas Technology, Design and Applications
Submission of Papers
Paper submission must be done on-line through the conference web site at TBD. The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 6 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email asqed2015 @ asqed.com.