ASQED 2015 Technical Program Committee
Yiran Chen, University of Pittsburgh (chair)
Chen-Yong Cher, IBM (co-Chair)
IoT, Smart Sensors Design and Technology (SSDT)
Hai Li, University of Pittsburgh (Chair)
Haibo Wang, Southern Illinois University (Co-Chair)
Committee Members:
System-level Design and Methodologies (SDM)
Michael Huebner, Ruhr-University (Chair)
Wei Zhang (Co-Chair)
Committee Members:
Abbes Amira - University of the West of Scotland, UK
Rajesh Berigei - Texas Instruments Inc.
Yu Cai - LSI Corporation
Deming Chen - University of Illinois, Urbana-Champaign
Eui-Young Chung - Yonsei University
Alberto Del Barrio Garcia - Complutense University of Madrid
Fabiano Hessel - PUCRS
Chih-Tsun Huang - National Tsing Hua University, Taiwan
Mohammad Khavari Tavana - George Mason University
Seung-Eun Lee - Seoul National University of Science and Technology
Duo Liu - Chongqing University
Farhad Mehdipour - E-JUST Center, Kyushu University
Qinru Qiu - Syracuse University
V. Ramgopal Rao - IIT Bombay
Shanq-Jang Ruan - National Taiwan University of Sci. and Tech.
Libor Rufer - University of Grenoble / TIMA Laboratory
Ashraf Salem - Mentor Graphics
Chung-An Shen - National Taiwan University of Science and Technology
Sharad Sinha - The Hong Kong University of Science and Technology
Jay Sivagnaname - Freescale Semiconductor
Haibo Wang - Southern Illinois University
Bin Wu - Qualcomm Inc.
Teong Guan Yew - Intel Corporation
Package and Three-Dimensional Integration (PTDI)
Farhang Yazdani, BroadPak Corporation, USA (Chair)
Wenyan Yin, Zhejiang University (Co-Chair)
Committee Members:
Ibrahim Ahmad - Universiti Tenaga Nasional
Yuuki Araga - National Institute of Advanced Industrial Science and Technology (AIST), Japan
Bok Eng Cheah - Intel Corporation
Guoqing Chen - AMD
Houle Gan - Intel
Minghui Han - Samsung
Nauman Khan - Intel Corporation
SoYoung Kim - SungKyunKwan University
Yong Liu - Fairchild Semiconductor
Pol Marchal - IMEC, Belgium
Vasilis Pavlidis - University of Manchester
Weiping Shi - Texas A&M University
Jianyong Xie - Intel Corporation
Cindy-Yang Yi - University of Kansas
Payman Zarkesh-Ha - University of New Mexico
Integrated Circuit Design (ICD)
Xiaoyang Zeng (Chair)
Chuan Zhang, Southeast University (Co-Chair)
Zushu Yan (Co-Chair)
Committee Members:
Ali Afzali-Kusha - University of Tehran
Jin-Ho Ahn - Hoseo University
George Alexiou - University of Patras
Chin Hai Ang - Altera Corporation Sdn Bhd
Sanghyun Baeg - Hanyang University
Sudarshan Bahukudumbi - Intel Corporation
Chip Hong CHANG - Nanyang Technological University
Subho Chattejee - Intel Custom Foundry.
Marshnil Dave - Marvell Semiconductors
Serge Demidenko - Massey University
Abhilash Goyal - Oracle
Stephen Heinrich-Barna - Texas Instruments, Inc
Qijun Huang - Wuhan University
Shyh-Jye Jou
Rouwaida Kanj - American University of Beirut
Tony T. Kim - Nanyang Technological University
Choon Hou Lock - Intel
Hidetoshi Matsuoka - Fujitsu Laboratories Ltd
Pascal Meinerzhagen - Intel Circuit Research Lab
Rajendra Patrikar - VNIT Nagpur
Radu Secareanu - Freescale
Maryam Shojaei Baghini - IIT-Bombay
Jawar Singh - Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India
Lei Wang - University of Connecticut
Yong Wang - Shangdong Univ
Yintang Yang - Xidian Univ
Jun Yin - University of Macau
Yongsheng Yin - Hefei University of Technology
Jingyi Zhang - Broadcom
Yaohua Zhao - Mediatek
Geng Zheng - Analog Devices Inc.
EDA,IP Cores; Interop, Security, and Reuse (EDA)
James Lei, Applied Harmonics Corp (Chair)
Andre Reis, UFRGS (Co-Chair)
Committee Members:
Swarup Bhunia - Case Western Reserve University
ASRAL BIN BAHARI JAMBEK
Swaroop Ghosh - University of South Florida
Chien-Nan Liu - National Central University
Alexander Mitev - Aries Design Automation
Guo Yu - Oracle Corporation
Min Zhao - Oracle Corportation
Cheng Zhuo - Intel
Design Verification and Design for Test (DVFT)
Miroslav Velev, Aries Design Automation (Chair)
Sungho Kang, Yonsei University (Co-Chair)
Committee Members:
Jin-Ho Ahn - Hoseo University
Mohana Asha Latha Dubasi - North Dakota State University
Masahiro Fujita - University of Tokyo
Patrick Girard - LIRMM
Yanxiang He - Wuhan Univ
Michael Hsiao - Virginia Tech
Jiun-Lang Huang - National Taiwan University
Moiz Khan - Synopsys Inc.
Jin-Fu Li - National Central University
Sungju Park - Hanyang University
Spyros Tragoudas - Southern Illinois University
Yiorgos Tsiatouhas - University of Ioannina
Raimund Ubar - Tallinn University of Technology
Vinod Viswanath - Real Intent
Physical Design, Methodologies & Tools (PDM)
Aida Todri-Sanial, LIRMM (Chair)
Bao Liu, University of Texas at San Antonio (Co-Chair)
Committee Members:
Ibrahim Ahmad - Universiti Tenaga Nasional
Boon-Chong Ang - eASIC
Senthil Arasu - Broadcom
Kevin Brelsford - Synopsys
Yuanqing Cheng
Shih-Hsu Huang - Chung Yuan Christian University
Yu-Min Lee - National Chiao Tung University
Barry Linder
Karthikeyan Lingasubramanian - University of Alabama at Birmingham
Yuchun Ma - Tsinghua University
Renato Ribas - UFRGS
Jia Wang - Illinois Institute of Technology
Hua Xiang - IBM
Hu Xu - NVIDIA Corporation
Fakhrul Zaman Rokhani
Xuan Zeng - Fudan Univ
Emerging Process & Device Technologies (EDT)
Jawar Singh, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India (Chair)
Hua-Qiang Wu, Tsinghua University (Co-Chair)
Committee Members:
Paulo Butzen - Universidade Federal do Rio Grande - FURG
Eric Foreman - IBM
Amlan Ghosh - AMD
Lili He - San Jose State University
Vivek Joshi - GLOBALFOUNDRIES
Pankaj Kalra - SanDisk
Nikos Konofaos - Aristotle University of Thessaloniki
Hai Li - University of Pittsburgh
Yiming Li - National Chiao Tung University
Jimson Mathew - University of Bristol
Saraju Mohanty - University of North Texas
Arthur Nieuwoudt - Synopsys
Takashi Sato - Kyoto University
Yiyu Shi - Missouri University of Science and Technology
Tahui Wang - National Chiao Tung University, Taiwan
Xuefeng Zeng - Globalfoundries US Inc.
Ehrenfried Zschech - Fraunhofer IKTS Dresden
Design for Manufacturability/Yield & Quality (DFQ)
Xuan Zeng, Fudan Univ (Chair)
Yiyu Shi, Missouri University of Science and Technology (Co-Chair)
Committee Members:
Swarup Bhunia - Case Western Reserve University
Shir-Shen Chang - Synopsys
Chien-Nan Liu - National Central University
Yuchun Ma - Tsinghua University
Alexander Mitev - Aries Design Automation
Andre Reis - UFRGS
Antennas Technology, Design and Applications (ANT)
Bing-Zhong Wang, University of Electronic Science and Technology of China (Chair)
Rushan Chen, Nanjing University of Science and Technology (NUST) (Co-Chair)
Committee Members:
Lixin Guo - Xidian Univ
Srini Krishnamoorthy - Advanced Micro Devices
Haiwen Liu - NA
Guoqing Luo - Hangzhou Dianzi University
Yueping Zhang - Nanyang Technological Univ