Press Release
3rd Asia Symposium on Quality Electronic Design (ASQED) Announces Program;
Convenes July 19‐20, Kuala Lumpur, Malaysia
PDF Version
SAN JOSE, CA and Kuala Lumpur, Malaysia – May 18, 2011 – The third Asia Symposium on Quality Electronic Design ( ASQED ) today announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations
ASQED is being held on July 19-20, 2011 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nano-electronic, bio-electronic, MEMS (microelectromechanical) and NEMS (nanoelectromechanical) systems, and photovoltaic (PV) technologies and disciplines such as design, manufacturing, test and packaging.
Powerful Keynotes Headline Conference
ASQED keynote sessions are sponsored by Synopsys and include:
Nanotechnology and the Challenges Facing Designers of Circuits and Systems
Prof. Arokia Nathan
Chair of Nanotechnology, London Centre for Nanotechnology,
University College London, England
Electronics for Energy Management
Dr. Bernard Courtois
Director of CMP and TIMA, France
The Packaging Technology Domain
Prof. Younggap You
Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea
Challenges in Interconnection
Dr. ChoonHeung Lee
Head of Corp. Technology, Amkor, Korea
Advances in High Density Interconnections-Promoting Innovations and Lower Costs
Happy Holden
Chief Technical Officer, Foxconn Advanced Technology, Taiwan
Tutorials
ASQED is pleased to offer the following tutorials by industry experts:
A Tool Box for Successful 3D Integration
Mark Scannell
Program Director, 3D Integration
CEA – Léti, France
Modern 3D Packaging Technologies Driving the Need for IC, Package and Printed Circuit Board (PCB) Co-Design Methodologies
John Park
Methodology Architect
Mentor Graphics, USA
Memory Packaging Challenges and Approaches for the Evolving World of the Portable Client and Cloud
Richard Crisp
Principal Technologist
Tessera, USA
3D Silicon Interposer and Through Silicon Via (TSV): Application, Requirement, Infrastructure and Technologies
Farhang Yazdani
President and CTO
BroadPak Corporation, USA
Technical Sessions
The ASQED technical sessions consist of over 50 papers by engineers and researchers worldwide.
About ISQED
ASQED is the third event organized by the International Society for Quality Electronic Design (www.ISQED.com) in Asia. Conference proceedings are published by the IEEE.
Please visit http://www.asqed.com for more information and to register.
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Press Contact:
Georgia Marszalek, ValleyPR LLC for ASQED, +1-650-345-7477, Georgia@ValleyPR.com
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