ASQED 2013 Technical Program Committee
Masahiro Fujita, University of Tokyo, Japan (chair)
Kyoungrok Cho, Chungbuk Nationall University, Korea(co-Chair)
Circuit and System Design
Alexander Fish, Bar-Ilan University (Chair)
Matthew Law, University of Macau (Co-Chair)
Committee Members:
Ali Afzali-Kusha - University of Tehran, IRAN
Abbes Amira - University of the West of Scotland, UK
Farid Boussaid - The University of Western Australia
Andreas Burg - Telecommunications Circuits Lab, EPFL
Chip Hong CHANG - Nanyang Technological University
Denis Chen
Zhiyuan Chen - University of Macau
Kyeongsoon Cho - Hankuk University of Foreign Studies
Zhiqiang Cui - Qualcomm
Oğuz Ergin - TOBB University of Economics and Technology
Fabiano Hessel - Pontifical Catholic University of Rio Grande do Sul - PUCRS
Tony T. Kim - Nanyang Technological University
Sylvain Leomant - Infineon
Itamar Levi
Hai Li - Polytechnic Institute of NYU
Saraju Mohanty - University of North Texas
Kash Ng - UWA
Vasileios Pavlidis - University of Manchester
Jose Pineda de Gyvez - NXP Semiconductors
Khaled Salama - King Abdullah University of Science and Technology
Emre Salman - Stony Brook University
Radu Secareanu - Freescale Semiconductor
Maryam Shojaei Baghini - IIT-Bombay
Jay Sivagnaname - Freescale Semiconductor
Eran Socher - Tel Aviv University
Franky Tang - Hong Kong University of Science and Technology
Adam Teman - Ben Gurions University
Keith Un - University of Macau
JiangChao Wu - University of Macau
Hu Xu - Synopsys Intl. Ltd.
Zushu Yan - University of Macau
Jun Yin - Hong Kong University of Science and Technology
Yongsheng Yin - Hefei University of Technology
Han Yu
Jingyi Zhang - Broadcom
Yaohua Zhao - University of Macau
Geng Zheng - University of North Texas
Sensors, MEMS/NMES
V. Ramgopal Rao, IIT Bombay (Chair)
Hongrui Jiang, University of Wisconsin - Madison (Co-Chair)
Committee Members:
Shoushun Chen - Nanyang Technological University, Singapore
Ye Liu - Oracle Corporation
Hisayo S. Momose - Toshiba Corporation
Frederic Nabki - University of Quebec at Montreal (UQAM)
Arthur Spivak - University of Calgary Alberta, Canada
Shuji Tanaka - Tohoku University
Haibo Wang - Southern Illinois University Carbondale
Xuefeng Zeng - Globalfoundries US Inc.
Difeng Zhu - Micron. Technology Inc.
Advanced IC Packaging,PWB/PCB,Interconnection, Signal/Power Integrity
Farhang Yazdani, BroadPak Corporation, USA (Chair)
Paul Franzon, North Carolina State University (Co-Chair)
Committee Members:
Ibrahim Ahmad - UNIVERSITI TENAGA NASIONAL
Mario Bolanos - Texas Instruments
Bok Eng Cheah - Intel Corporation
Ryan Coutts - Qualcomm
Houle Gan - Intel Corp.
Johnny C. Ho - City University of Hong Kong
Yi-Shao Lai - ASE Group
Yong Liu - Fairchild Semiconductor
Manuel Luschas - Broadcom
Electronic Design Automation Methodologies
Abbes Amira, University of the West of Scotland, UK (Chair)
Committee Members:
Koustav Bhattacharya - Intel Corporation
Eui-Young Chung - Yonsei University
Alberto Del Barrio Garcia - Complutense University of Madrid
Maziar Goudarzi - Sharif University of Technology
Shiyan Hu - Michigan Technological University
Yongseok Kang - LG Electronics
Young Hwan Kim - Pohang University of Science and Technology, Korea
Yu-Min Lee - National Chiao Tung University
Yuchun Ma - Tsinghua University
Arjuna Madanayake - University of Akron
Farhad Mehdipour - E-JUST Center, Kyushu University
Alexander Mitev - Aries Design Automation
Arthur Nieuwoudt - Synopsys
Seda Ogrenci Memik - Northwestern University
Oghenekarho Okobiah - University of North Texas
Sanghamitra Roy - Utah State University
Yiyu Shi - Missouri University of Science and Technology
Tuna B. Tarim - Texas Instruments, Inc.
Jane Wang - Cadence Design Systems, Inc.
Jia Wang - Illinois institute of Technology
Hua Xiang - IBM T.J. Watson Research
Haobo Yu - Marvell Semiconductor
Test and Verification & Design For Test
Sungho Kang, Yonsei University (Chair)
Committee Members:
Jin-Ho Ahn - Hoseo University
George Alexiou - Univ. of Patras
Chin Hai Ang - Altera Corporation Sdn Bhd
Sudarshan Bahukudumbi - Intel Corporation
Ateet Bhalla - Oriental Institute of Science and Technology, Bhopal
Mario Bolanos - Texas Instruments
Sreejit Chakravarty - LSI Corporation
Jennifer Dworak - Southern Methodist University
Abhilash Goyal - Oracle America (Sun Microsystems)
Themistoklis Haniotakis - University of Patras
Yongseok Kang - LG Electronics
Hongsik Kim - SK Hynix Inc.
Hyunjin Kim - Dankook University
Bao Liu - University of Texas at San Antonio
Sungju Park - Hanyang University
Kiran Puttaswamy - Intel Corp.
Yiorgos Tsiatouhas - University of Ioannina
Raimund Ubar - Tallinn University of Technology
Arnaud Virazel - LIRMM / University of Montpellier
Hyunbean Yi - Hanbat National University
Semiconductor Process/Devices & Micro/Nano Technology, Reliability and Quality
Peter Wright, Synopsys (Chair)
Valeriy Sukharev, Mentor Graphics Corporation (Co-Chair)
Committee Members:
Mehdi Anwar - University of Connecticut
Yiran Chen - University of Pittsburgh
Hua Fang - PDF Solutions
Seiichiro Kawamura - Japan Science & Technology Agency
Nikos Konofaos - Aristotle University of Thesaloniki
Prashanthi Kovur - University of Alberta, Canada
Yiming Li - National Chiao Tung University
Renato Ribas - UFRGS
Tahui Wang - National Chiao Tung University, Taiwan