Keynotes at ASQED 2011
July 19-20
NANOTECHNOLOGY AND THE CHALLENGES FACING DESIGN OF CIRCUITS AND SYSTEMS
Prof. Arokia NathanSumitomo/STS Chair of Nanotechnology
London Centre for Nanotechnology, University College London
Nanotechnology refers to the precise control of the structure of matter at the atomic/molecular level for the creation of new functional materials, devices, and systems. It is multi-disciplinary, simultaneously drawing from and benefiting areas such as materials science and engineering, chemistry, physics, biology and medicine. Indeed nanotechnology is all about generating new solutions based on atomic- and molecular-scale manipulations. This talk will review these new and exciting research opportunities, and the wide variety of benefits to society that nanotechnology can deliver, addressing applications ranging from information technology and healthcare to energy and the environment. In particular, the question arises as to whether nanotechnology is ready for realization of circuits and systems and if circuit techniques can be deployed to compensate for material shortcomings to meet performance requirements. We will review these challenges and examine design considerations pertinent to thin film circuits, such as on-pixel current drivers and amplifiers, on glass and plastic substrates, whose integration requires non-conventional design solutions to deal with the high instability. The family of circuits presented here will address two application areas: the organic display and digital fluoroscopy for medical applications.
About Arokia Nathan
Prof. Arokia Nathan holds the Sumitomo/STS Chair of Nanotechnology at the London Centre for Nanotechnology, University College London. His research interests relate to materials processing and device integration using disordered inorganic and organic semiconductors on rigid and flexible substrates. His work on TFT integration was transferred to IGNIS Innovation Inc., a company he founded to commercialize technology on active matrix organic displays. Following his PhD in Electrical Engineering from the University of Alberta, Canada, he was with LSI Logic Corp., CA, and the Institute of Quantum Electronics, ETH Zürich, Switzerland, before joining faculty at the University of Waterloo. He has held visiting professorship positions at ETH Zürich and University of Cambridge. He has published extensively in sensor technology and CAD, and thin film transistor electronics, and holds numerous patents, and is a co-author of two books. He serves on technical committees and editorial boards at various capacities.
Electronics for Energy Management
Dr. Bernard Courtois Director of CMP, and TIMA, France
The talk will deal with how ICs can address energy issues like the generation, the conversion, the use, the storage, of energy. Energy management is indeed a major issue for the world. Several domains are reviewed like equipment, buildings, lighting, transport, industry. Such a topic complements another important topic addressed for ICs themselves, namely the design of low-power devices. A way for future ultra low power devices is also addressed.
About Bernard Courtois
Bernard COURTOIS received the Engineer degree in 1973, and next the « Docteur-Ingénieur » and « Docteur-ès-Sciences » degrees from the Institut National Polytechnique de Grenoble. He is currently the Director of CMP Service. He was also the founding Director of the Laboratory of Techniques of Informatics and Microelectronics for Computer Architecture (TIMA) where researches include CAD, architecture and testing of integrated circuits and systems. He has been general chair or program chair of many international conferences and workshops. He is Doctor Honoris Causa of the Technical University of Budapest.
The Packaging Technology Domain: reflecting the national economic development frontier
Prof. Younggap You Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea
Human behavior has been a key parameter in innovation and generation of the market demand. Packaging technology domain reflects various aspects of such demand that leads to product competitiveness in the market place. The evolutionary progression of electronic packaging technology that begun with wooden and metal constructs for early versions of electronic products when the national economy was in the post-war poverty phase now follow the footprints of key products facing severe business competition. Current economic prosperity may afford products viewed as gadgets in applications that range from health care, education, through to leisure-derived functionalities. The rapid economic development of Korean society has experienced this very wide spectrum of packaging technology within relatively a short time frame. The presentation will review the background, and will focus on the cultural motivation of economic development in the Korean society within the critical nature and framework of electronic packaging in semiconductor industry. Survey of the state of the art technology, the immediate market demands and the more generic long term prediction of the products requiring the technology will be ventured into. Some comments that relate to social and cultural changes will be highlighted with the focus on that future of the technology to be predicted by observing the past history of economic development and social demands imposed by intelligent products.
About Prof. Younggap You
Prof. Younggap You received his B.S.E. degree from the Sogang Jesuit University in 1975 (cum laude). He received his M.S.E. and Ph.D. degree from the University of Michigan, Ann Arbor, Michigan, in 1981 and 1986, respectively. He has been with the Agency for Defense Development, Korea and LG Semiconductor. He founded three electronic firms and one financial company in Korea. He has consulted with the Chungbuk Venture Capital for seven years as a technical adviser. He authored five books and more than two hundred technical papers and holds 30 patents. Currently he is the Dean of Electrical and Computer Engineering College of Chungbuk National University. His research interest includes high speed printed circuits, three dimensional chip stacking, cryptography and bio-medical instrumentation.
Challenges in Interconnection
Dr. ChoonHeung Lee Head of Corp. Technology HQ, Amkor
Flipchip technologies have been evolved to grab the major portion of the high and medium performance markets, where the bump interconnections are required. Bumps can be diverse in their contents, that is, binary, ternary, etc.. The most popular alloy is SnPb (eutectic), while the environmental importance pushes the market to adapt the green solution where SnAg or SnCu can be one of the choice. Considering the electrical performance including electro-migration effect and simplicity of the process, Cu bumps is chosen to be an alternative. Challenges in Cu pillar interconnection in flipchip and Through Silicon Via applications will be discussed and also Cu wire bonding challenges will be addressed.
About Dr. ChoonHeung Lee
ChoonHeung Lee is currently the Head of Corp. Technology HQ, Amkor Korea Technology Inc. Lee joined Amkor in 1996 as the team manager of Simulation Team and Advanced Product Development Team. After seven years he was promoted to the Head of R&D and later in 2010 he became Head of Corp. Technology HQ. Prior to joining Amkor, Lee was a postdoctoral researcher of Korea University from 1994 to 1995 and was a research associate in the Physics Department of Case Western Reserve University from 1993 to 1994. As a researcher who majored Theoretical Solid State Physics specializing in Heterojunction Semiconductor, Packaging Technology and Thermal, Mechanical, Electrical FTIR, SAT, SEM, Lee wrote 23 research papers on related subjects and filed 40 patent applications in Korea and 22 in the US. Among those, 26 patents in Korea and 11 in the US have been granted. Lee holds Ph.D. and Masters Degree in Physics from Case Western Reserve University, Cleveland, and Masters in Statistical Physics and Bachelor in Physics from Korea University.
Advances in High Density Interconnections-Promoting Innovations and Lower Costs
Happy Holden Chief Technical Officer, Foxconn Advanced Technology
This will be a short overview of some of the latest ‘Innovations’ to come out of Asia for printed circuit production in the last 2 years. These new capabilities greatly enhance the high-density PCB performance or lower the costs of some of the higher-density but expensive HDI processes now in High-Volume-Manufacturing (HVM). Eight (8) technologies, processes or equipment will be highlighted, many of which have not found their way to introduction yet to the North American or European PCB fabrication markets.
About Happy Holden
Happy Holden is the Chief Technical Officer for Foxconn Advanced Technology, a major part on Hon Hai Precision Industries of Taiwan. Formerly, he was the Senior PCB Technologist for Mentor Graphic’s System Design Division. Prior to joining Mentor, he was the Advanced Technology Manager at NanYa/Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Mr. Holden formally managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignments with HP had been as director of PCB R&D. He holds degrees in Chemical Engineering and Computer Science and is a member of the IPC, SMTA, IMAPS and the IEEE.