ASQED 2010 Technical Program Committee
Volkan Kursun, Hong Kong University of Science and Technology (Chair)
Circuit & System Design
Chair: Amine Bermak, Hong Kong University of Science and Technology, China
Co-chair: Radu Secareanu, Freescale Semiconductor, USA
Myung Hoon Sunwoo, Ajou University, Korea
Jinyong Chung, Pohang University of Science and Technology, Korea
Vasileios Pavlidis, Ecole Polytechnique Federale de Lausanne, Switzerland
Massimo Alioto, University of Siena, Italy
Magdy Bayoumi, University of Louisiana at Lafayette, USA
Jin-Gyun Chung, Chonbuk National University, Korea
Dinesh Somasekhar, Intel Corporation, USA
Tamer Ragheb, Texas Instruments Incorporated, USA
Yong-Bin Kim, Northeastern University, USA
Samuel Palermo, Texas A&M University, USA
Suphachai Sutanthavibul, Intel Corporation, Malaysia
Guoqing Chen, Intel Corporation, USA
Pak Kwong Chan, Nanyang Technological University, Singapore
Chip Hong Chang, Nanyang Technological University, Singapore
Praveen Elakkumanan, IBM, USA
Michael A. Soderstrand, Devry University, USA
Steve Yang, ICScape Inc., USA
Abbes Amira, Brunel University, England
Saraju Mohanty, University of North Texas, USA
Rizwan Bashirullah, University of Florida, USA
Ali Afzali-Kusha, University of Tehran, Iran
Haibo Wang, Southern Illinois University, USA
Jay Sivagnaname, Freescale Semiconductor, USA
Mohd Sulaiman, MIMOS Bhd, Malaysia
Maziar Goudarzi, Sharif University of Technology, Iran
Nikhil Jayakumar, Juniper Networks, USA
Rajesh Garg, Intel Corporation, USA
Srinivas Bodapati, Intel Corporation, USA
Jaydeep P. Kulkarni, Intel Corporation, USA
Yue Ping Zhang, Nanyang Technological University, Singapore
Electronic Design Automation Methodologies
Chair: Seda Ogrenci Memik, Northwestern University, USA
Co-chair: Kiyoung Choi, Seoul National University, Korea
Baris Taskin, Drexel University, USA
Murat Becer, CLK Design Automation, USA
Rasit O. Topaloglu, Global Foundries, USA
Young Hwan Kim, Pohang University of Science and Technology, Korea
Azadeh Davoodi, University of Wisconsin - Madison, USA
Sanghamitra Roy, Utah State University, USA
Qiang Xu, Chinese University of Hong Kong, China
Frank Liu, IBM, USA
Vladimir Zolotov, IBM, USA
Yuchun Ma, Tsinghua University, China
Shiyan Hu, Michigan Tech University, USA
Sun Woo Chung, Korea University, Korea
Eui-Young Chung, Yonsei University, Korea
Minsik Cho, IBM, USA
Fabiano Hessel, Pontifícia Universidade Católica do Rio Grande do Sul, Brazil
Yu-Min Lee, National Chiao Tung University, Taiwan
Sao-Jie Chen, National Taiwan University, Taiwan
Jane Wang, Cadence Taiwan Incorporated, Taiwan
Jia Wang, Illinois Institute of Technology, USA
Hua Xiang, IBM, USA
Jiang Hu, Texas A&M University, USA
Farhad Mehdipour, Kyushu University, Japan
Yu Wang, Tsinghua University, China
Alexander Mitev, Aries Design Automation, USA
James Junzhao Lei, Altera Corporation, USA
IC Packaging and PCB Technology & Manufacturing
Chair: Farhang Yazdani, BroadPak Corporation, USA
Co-chair: Ibrahim Bin Ahmad, Universiti Tenaga Nasional, Malaysia
Kamesh Gadepally, NSC, USA
Yici Cai, Tsinghua University, China
Bio Electronics
Chair: Yiran Chen, Seagate Technology, USA
Co-chair: Levent Yobas, Institute of Microelectronics, Singapore
Krishnendu Chakrabarty, Duke University, USA
Farid Boussaid, The University of Western Australia, Australia
George Yuan, Hong Kong University of Science and Technology, China
Khaled Nabil Salama, King Abdullah University of Science and Technology, Saudi Arabia
Photovoltaic Technology & Manufacturing
Chair: Ali Iranmanesh, Silicon Valley Technical Institute, USA
Co-Chair: Bao Liu, University of Texas San Antonio, USA
Hua Fang, PDF Solutions, China
Semiconductor Devices & Nanotechnology
Chair: Zhenan Tang, Dalian Institute of Semiconductors, China
Co-chair: Yiming Li, National Chiao Tung University, Taiwan
Seiichiro Kawamura, National Institute of Advanced Industrial Science and Technology, Japan
Hisayo Sasaki Momose, Toshiba Corporation, Japan
Mehdi Anwar, University of Connecticut, USA
Mansun Chan, Hong Kong University of Science and Technology, China
Jin He, Peking University, China
Nikos Konofaos, University of the Aegean, Greece
Hai Li, Polytechnic Institute of NYU, USA
Shubhankar Basu, Cadence, USA
Valeriy Sukharev, Mentor Graphics, USA
Suhaidi Shafie, Universiti Putra Malaysia, Malaysia
Swaroop Ghosh, Intel Corporation, USA
Peter Wright, Synopsys Incorporated, USA
Tahui Wang, National Chiao Tung University, Taiwan
Test & Verification
Chair: Patrick Girard, Le Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier, France
Co-chair: Sungho Kang, Yonsei University, Korea
George Alexiou, University of Patras, Greece
Sudarshan Bahukudumbi, Intel Corporation, Malaysia
Chin Hai Ang, Altera Corporation (M) Sdn Bhd, Malaysia
Alberto Bosio, Le Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier, France
Arnaud Virazel, Le Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier, France
Kiran Puttaswamy, Intel Corporation, USA
Jennifer Dworak, Brown University, USA
Shankar Hemmady, Synopsys Incorporated, USA
Mahalingam Venkataraman, Texas Instruments, USA
Sreejit Chakravarty, LSI Corporation, USA
Raimund Ubar, Tallinn University of Technology, Estonia
Spyros Tragoudas, Southern Illinois University Carbondale, USA
Miroslav Velev, Aries Design Automation, USA
Yiorgos Tsiatouhas, University of Ioannina, Greece
Themistoklis Haniotakis, University of Patras, Greece
Ateet Bhalla, Technocrats Institute of Technology, Bhopal, India
Moiz Khan, Synopsys Incorporated, USA
Micro/Nano-Electro-Mechanical Systems (MEMS/NEMS)
Chair: Bernard Courtois, Circuits Multi Projects - CMP, Grenoble, France
Co-chair: V. Ramgopal Rao, Indian Institute of Technology, Bombay, India
Shuji Tanaka, Tohoku University, Sendai, Japan
Hongrui Jiang, University of Wisconsin - Madison, USA
Renato Ribas, Universidade Federal do Rio Grande do Sul