ASQED 2009 Program
Keynotes
A New World of Partnerships for 22nm and Below
The Present Status and Issues in Solar Photovoltaic Systems
IC Packaging Technology - Electronic's New Gatekeeper for Cost and Performance
Trust But Verify – Product Quality in the SoC Era
Variability-Resilient Mixed-Signal IC Design Methods
Panel Discussion & Dinner (sponsored by MIDA)
Global Trends of Electronic Industry and opportunities for Malaysia
Tutorials
Tera-scale Computing and Interconnect Challenges – 3D Stacking Considerations
Advanced Packaging Technologies and Future Interconnection Trends
Technical Sessions
Advanced Memory and Special Circuit Techniques
Multi-gate Devices and Manufacturing
Power Delivery, Packaging and PCB Technology
Low-power and Noise-aware Design Innovations
Noise, Reliability, and Variability
Nano and Bio Electronics Innovations
Photovoltaic Technology & Manufacturing
Analog and Low Power Test
Misc. Design Topics
CMOS Imagers and Data Converters
Physical and System Design
Advanced Topics in Design
Semiconductor Technology & Manufacturing
Test & Verification