Signaling Analysis of Inter-Chip I/O Package Routing for Multi-Chip Package

Khang Choong Yong1,  Wil Choon Song1,  Bok Eng Cheah1,  Mohd Fadzil Ain2
1Intel Microelectronics (M) Sdn. Bhd, Halaman Kg. Jawa, Penang, Malaysia, 2School of Electrical and Electronic Engineering, Universiti Sains Malaysia, Penang, Malaysia


In short, this research has successfully characterized the key limiting factors of high speed inter-chip I/O package interconnection design for MCP implementations. The microwave effect is found relatively more dominant in transmission line compared to other system components. Sensitivity analysis results show signal quality is inversely proportionate to the operating frequency and inter-chip I/O package transmission length. The degradations of signal quality and overshoot performance are strongly dominated by crosstalk and reflection factors. Although crosstalk and signal reflection are the identified key limiting factors, optimization of line loss does contribute to optimum eye opening when it comes to higher operating frequency i.e. beyond 5GHz and extensive transmission channel length of 15mm. A matrix table consisting limiting factors in corresponding to operating frequency and inter-chip I/O package interconnection channel length has been established to serve as an initial reference guide towards successful development of MCP products. This study has also laid the groundwork for subsequent studies of inter-chip I/O circuit and package routing design optimization, judging from its predominant influence in this paper.