The scalable Y-patterned power plane design is shown to have successfully reduced the solder ball Imax by 25% with negligible IR drop impact compared conventional fully-plated power plane design. The improved BGA Imax performance is not only vital to mitigate product reliability risks but also uncovers the potential of package form-factor miniaturizations and platform BOM cost savings through BGA ball-count reduction. The scalable Y-patterned design was also found favorable in terms of thermal dissipation the across power plane i.e. 3.7% and 8.0% power loss reduction compared to conventional fully-plated and cross-patterned power plane designs. It is ascertained that the scalable Y-patterned power plane design is a viable solution to address the challenges of rising BGA Imax and thermal dissipation for small form-factor designs and applications.