Package Level Failure Analysis: New Techniques and New Instruments for Better Results

Simona Pappalardo1,  Davide Caccialanza1,  Zukhairi Md Sarip2

1St Microelectronics, Agrate Brianza (Italy), 2St Microelectronics, Muar (Johor, Malaysia)

Abstract

In this paper we propose an integrated method for effective failure analysis at device package level. For this reason, some well-known techniques will be reviewed and some new methodologies proposed, in the effort of building an organic flow, able to localize the defect, highlight its physical attributes and so leverage the root cause identification.

Keywords: complex packages, substrate failure modes, substrate criticalities.